| dc.description.abstract |
In this work, Schottky diodes were fabricated on undoped and niobium-doped n-silicon (n-Si).
Niobium (Nb) doping was achieved by ion implantation at 160 keV to a fluence of 3 × 1015
ion.cm-2. The diodes were characterized by current-voltage (I-V) techniques at a temperature
ranging from 20 K to 360 K in steps of 20 K. A comparison of the change in diode parameters
evaluated from undoped and Nb-doped based diodes due to temperature was made to
understand the effects of the Nb dopant on the electrical properties of the diodes. In general,
the results indicated that the diodes were well fabricated and that Nb doping resulted in an
increase in the resistivity of Si. This increase in the resistivity is associated with Nb-induced
defects that are responsible for recombination of the mobile charge carrier in Si. A change in
I-V graphs from exponential to ohmic behaviour observed at a high temperature range due to
Nb doping indicates that in Si, Nb is responsible for the relaxation behaviour of the material.
Since the diodes fabricated on relaxation material are radiation-hard, Nb may, therefore, be a
suitable dopant in a study to improve the radiation-hardness of Si for current and future use. |
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